A High Performance Communication Architecture for a Smart Micro-Grid Testbed Using Customized Edge Intelligent Devices (EIDs) With SPI and Modbus TCP/IP Communication Protocols

A High Performance Communication Architecture for a Smart Micro-Grid Testbed Using Customized Edge Intelligent Devices (EIDs) With SPI and Modbus TCP/IP Communication Protocols

This paper presents a high performance 4-layer communication architecture for a smart micro-grid testbed which consists of a 2 kVA Distributed Energy Resource (DER) inverter with PV and battery channels capable of advanced grid supportive and grid forming functions in the Process layer, a Raspberry...

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Bibliographic Details
Main Authors: Yunpeng Si, Nikhil Korada, Raja Ayyanar, Qin Lei
Format: Article
Language:English
Published: IEEE 2021-01-01
Series:IEEE Open Journal of Power Electronics
Subjects:
Communication architecture
edge intelligent devices
smart micro-grid
SPI and Modbus communication protocols
Online Access:https://ieeexplore.ieee.org/document/9325535/

Internet

https://ieeexplore.ieee.org/document/9325535/

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