Growth behaviors of intermetallic compounds on the Sn-0.7Cu-10Bi-xCo/Co interface during multiple reflow
The Sn-0.7Cu-10Bi-xCo/Co (SCB-xCo/Co) interface reaction during soldering process, and the growth and evolution of intermetallic compounds (IMCs) after multiple reflow were investigated. The experimental results indicated that the IMCs layer was successively delaminated, dissolved and aggregated dur...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2019-07-01
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| Series: | Materials & Design |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S026412751930231X |