Growth behaviors of intermetallic compounds on the Sn-0.7Cu-10Bi-xCo/Co interface during multiple reflow

Growth behaviors of intermetallic compounds on the Sn-0.7Cu-10Bi-xCo/Co interface during multiple reflow

The Sn-0.7Cu-10Bi-xCo/Co (SCB-xCo/Co) interface reaction during soldering process, and the growth and evolution of intermetallic compounds (IMCs) after multiple reflow were investigated. The experimental results indicated that the IMCs layer was successively delaminated, dissolved and aggregated dur...

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Bibliographic Details
Main Authors:	He Gao, Fuxiang Wei, Yanwei Sui, Jiqiu Qi
Format:	Article
Language:	English
Published:	Elsevier 2019-07-01
Series:	Materials & Design
Online Access:	http://www.sciencedirect.com/science/article/pii/S026412751930231X

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