Analysis of the Influence of Shrinkage Tensile Stress in Potting Material on the Anti-Overload Performance of the Circuit Board
In this article, the influence of shrinkage tensile stress in potting materials on the anti-overload performance of a circuit board was studied. Firstly, the phenomenon of shrinkage tensile stress in common potting materials was analyzed, and it was found that the commonly used potting adhesives dis...
| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2021-03-01
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| Series: | Sensors |
| Subjects: | |
| Online Access: | https://www.mdpi.com/1424-8220/21/7/2316 |