Probabilistic approaches and reliability design of power modules
The weak point for the standard power IGBT modules in terms of reliability is thermal fatigue in solder joints due to the thermal stress induced by constitutive materials with different coefficients of thermal expansion (CTE). So far, many researches are aimed at defining accurate finite element sim...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
EDP Sciences
2008-04-01
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| Series: | International Journal for Simulation and Multidisciplinary Design Optimization |
| Subjects: | |
| Online Access: | https://www.ijsmdo.org/articles/smdo/pdf/2008/02/smdo2808.pdf |