An Improved Dispatching Method (a-HPDB) for Automated Material Handling System with Active Rolling Belt for 450 mm Wafer Fabrication
The semiconductor industry is facing the transition from 300 mm to 450 mm wafer fabrication. Due to the increased size and weight, 450 mm wafers will pose unprecedented challenges on semiconductor wafer fabrication. To better handle and transport 450 mm wafers, an advanced Automated Material Handlin...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2017-07-01
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| Series: | Applied Sciences |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2076-3417/7/8/780 |