A microscopic TEM study of the defect layers in cast-mono crystalline silicon wafers induced by diamond-wire sawing
Slicing silicon ingots into wafers by diamond-wire sawing (DWS) is an important step in the material production chain in the semiconductor industry. It will induce defect layers that are highly related to the stress release process and further influence wafers’ mechanical properties. This work aims...
| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
AIP Publishing LLC
2021-04-01
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| Series: | AIP Advances |
| Online Access: | http://dx.doi.org/10.1063/5.0034896 |