Evaluation of the thermal performance with different fin shapes of the air-cooled heat sink for power electronic applications
The proper selection of the heat sink, which is attached at the insulated-gate bipolar transistor (IGBT) module to dissipate heat by electric losses of the IGBT/diode chips, is important to satisfy the design criterion of the IGBT module. Prior to the performance evaluation of the air-cooled heat si...
| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Published: |
Taylor & Francis Group
2016-01-01
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| Series: | Journal of International Council on Electrical Engineering |
| Subjects: | |
| Online Access: | http://dx.doi.org/10.1080/22348972.2015.1115168 |