Highly thermally conductive polybenzoxazine composites based on boron nitride flakes deposited with copper particles
To solve the heat diffusion problem in electronic packaging, a novel kind of irregularly shaped hybrid filler, boron nitride@copper (BN@Cu), was successfully assembled via reduction of Cu2+. BN@Cu hybrid fillers composed of different mass ratios between BN and Cu have been prepared and characterized...
| Main Authors: | , , , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2020-06-01
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| Series: | Materials & Design |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S026412752030232X |