Reliability issues of lead-free solder joints in electronic devices
Electronic products are evolving towards miniaturization, high integration, and multi-function, which undoubtedly puts forward higher requirements for the reliability of solder joints in electronic packaging. Approximately 70% of failure in electronic devices originates during the packaging process,...
| Main Authors: | , , , , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Taylor & Francis Group
2019-12-01
|
| Series: | Science and Technology of Advanced Materials |
| Subjects: | |
| Online Access: | http://dx.doi.org/10.1080/14686996.2019.1640072 |