Synthesis and Characterization of SiO2 Nanoparticles and Their Efficacy in Chemical Mechanical Polishing Steel Substrate

Chemical mechanical polishing (CMP) technology is extensively used in the global planarization of highly value-added and large components in the aerospace industry. A nanopowder of SiO2 was prepared by the sol-gel method and was compounded into polishing slurry for the CMP of steel substrate. The si...

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Bibliographic Details
Main Authors: M. J. Kao, F. C. Hsu, D. X. Peng
Format: Article
Language:English
Published: Hindawi Limited 2014-01-01
Series:Advances in Materials Science and Engineering
Online Access:http://dx.doi.org/10.1155/2014/691967