Defect Filling Method of Sensor Encapsulation Based on Micro-Nano Composite Structure with Parylene Coating

Defect Filling Method of Sensor Encapsulation Based on Micro-Nano Composite Structure with Parylene Coating

The demand for waterproofing of polymer (parylene) coating encapsulation has increased in a wide variety of applications, especially in the waterproof protection of electronic devices. However, parylene coatings often produce pinholes and cracks, which will reduce the waterproof effect as a protecti...

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Bibliographic Details
Main Authors: Jialin Yao, Wenjiang Qiang, Xingqi Guo, Hanshui Fan, Yushuang Zheng, Yan Xu, Xing Yang
Format: Article
Language:English
Published: MDPI AG 2021-02-01
Series:Sensors
Subjects:
defect filling method
composite structure
parylene coatings
MEMS
pressure sensors
Online Access:https://www.mdpi.com/1424-8220/21/4/1107

Internet

https://www.mdpi.com/1424-8220/21/4/1107

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