TEM observation of interfaces in a solder joint in a semiconductor device
Microstructure of a joint between a Pb–Sn eutectic solder and an electroless Ni–8 mass% P has been examined using transmission electron microscopy. Four layers, i.e. Ni3Sn4, Ni48Sn52, Ni2SnP and Ni–20 mass% P, are formed between the solder and the electroless Ni–8 mass% P. Among them, Ni48Sn52 and N...
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| Format: | Article |
| Language: | English |
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Taylor & Francis Group
2002-01-01
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| Series: | Science and Technology of Advanced Materials |
| Online Access: | http://www.iop.org/EJ/abstract/-search=58668653.26/1468-6996/3/3/A04 |