Multiscale Analyses of Surface Failure Mechanism of Single-Crystal Silicon during Micro-Milling Process
This article presents an experimental investigation on ductile-mode micro-milling of monocrystalline silicon using polycrystalline diamond (PCD) end mills. Experimental results indicate that the irregular fluctuation of cutting force always induces machined surface failure, even in ductile mode. The...
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doaj-6b4f3d8f87044599a0b11a3035e8ec812020-11-24T23:44:03ZengMDPI AGMaterials1996-19442017-12-011012142410.3390/ma10121424ma10121424Multiscale Analyses of Surface Failure Mechanism of Single-Crystal Silicon during Micro-Milling ProcessJinxuan Bai0Qingshun Bai1Zhen Tong2School of Mechanical and Electrical Engineering, Harbin Institute of Technology, Harbin 150001, ChinaSchool of Mechanical and Electrical Engineering, Harbin Institute of Technology, Harbin 150001, ChinaCentre for Precision Technologies, University of Huddersfield, Huddersfield HD1 3DH, UKThis article presents an experimental investigation on ductile-mode micro-milling of monocrystalline silicon using polycrystalline diamond (PCD) end mills. Experimental results indicate that the irregular fluctuation of cutting force always induces machined surface failure, even in ductile mode. The internal mechanism has not been investigated so far. The multiscale discrete dislocation plasticity framework was used to predict the dislocation structure and strain evolution under the discontinuous cutting process. The results showed that a mass of dislocations can be generated and affected in silicon crystal. The dislocation density, multiplication rate, and microstructure strongly depend on the milling conditions. In particular, transient impulse load can provide a great potential for material strength by forming dislocations entanglement structure. The continuous irregular cutting process can induce persistent slip bands (PSBs) in substrate surface, which would result in stress concentration and inhomogeneous deformation within grains.https://www.mdpi.com/1996-1944/10/12/1424monocrystalline siliconbrittle materialsurface failure behaviordiscrete dislocation plasticitycrack |
collection |
DOAJ |
language |
English |
format |
Article |
sources |
DOAJ |
author |
Jinxuan Bai Qingshun Bai Zhen Tong |
spellingShingle |
Jinxuan Bai Qingshun Bai Zhen Tong Multiscale Analyses of Surface Failure Mechanism of Single-Crystal Silicon during Micro-Milling Process Materials monocrystalline silicon brittle material surface failure behavior discrete dislocation plasticity crack |
author_facet |
Jinxuan Bai Qingshun Bai Zhen Tong |
author_sort |
Jinxuan Bai |
title |
Multiscale Analyses of Surface Failure Mechanism of Single-Crystal Silicon during Micro-Milling Process |
title_short |
Multiscale Analyses of Surface Failure Mechanism of Single-Crystal Silicon during Micro-Milling Process |
title_full |
Multiscale Analyses of Surface Failure Mechanism of Single-Crystal Silicon during Micro-Milling Process |
title_fullStr |
Multiscale Analyses of Surface Failure Mechanism of Single-Crystal Silicon during Micro-Milling Process |
title_full_unstemmed |
Multiscale Analyses of Surface Failure Mechanism of Single-Crystal Silicon during Micro-Milling Process |
title_sort |
multiscale analyses of surface failure mechanism of single-crystal silicon during micro-milling process |
publisher |
MDPI AG |
series |
Materials |
issn |
1996-1944 |
publishDate |
2017-12-01 |
description |
This article presents an experimental investigation on ductile-mode micro-milling of monocrystalline silicon using polycrystalline diamond (PCD) end mills. Experimental results indicate that the irregular fluctuation of cutting force always induces machined surface failure, even in ductile mode. The internal mechanism has not been investigated so far. The multiscale discrete dislocation plasticity framework was used to predict the dislocation structure and strain evolution under the discontinuous cutting process. The results showed that a mass of dislocations can be generated and affected in silicon crystal. The dislocation density, multiplication rate, and microstructure strongly depend on the milling conditions. In particular, transient impulse load can provide a great potential for material strength by forming dislocations entanglement structure. The continuous irregular cutting process can induce persistent slip bands (PSBs) in substrate surface, which would result in stress concentration and inhomogeneous deformation within grains. |
topic |
monocrystalline silicon brittle material surface failure behavior discrete dislocation plasticity crack |
url |
https://www.mdpi.com/1996-1944/10/12/1424 |
work_keys_str_mv |
AT jinxuanbai multiscaleanalysesofsurfacefailuremechanismofsinglecrystalsiliconduringmicromillingprocess AT qingshunbai multiscaleanalysesofsurfacefailuremechanismofsinglecrystalsiliconduringmicromillingprocess AT zhentong multiscaleanalysesofsurfacefailuremechanismofsinglecrystalsiliconduringmicromillingprocess |
_version_ |
1725500291533504512 |