Thermal Stress Analysis of Chip Scale Packaging by Using Novel Multiscale Interface Element Method
In this study, a multiscale interface element method (MIEM) is developed to evaluate the interfacial peel and shear stress distributions in multilayer packaging structures. A newly developed polygon interface element contained many sides that could easily connect with many other polygon elements of...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
Hindawi Limited
2018-01-01
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| Series: | Mathematical Problems in Engineering |
| Online Access: | http://dx.doi.org/10.1155/2018/4962498 |