Electrochemical Migration Behavior of Copper-Clad Laminate and Electroless Nickel/Immersion Gold Printed Circuit Boards under Thin Electrolyte Layers

Electrochemical Migration Behavior of Copper-Clad Laminate and Electroless Nickel/Immersion Gold Printed Circuit Boards under Thin Electrolyte Layers

The electrochemical migration (ECM) behavior of copper-clad laminate (PCB-Cu) and electroless nickel/immersion gold printed circuit boards (PCB-ENIG) under thin electrolyte layers of different thicknesses containing 0.1 M Na2SO4 was studied. Results showed that, under the bias voltage of 12 V, the r...

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Bibliographic Details
Main Authors: Pan Yi, Kui Xiao, Kangkang Ding, Chaofang Dong, Xiaogang Li
Format: Article
Language:English
Published: MDPI AG 2017-02-01
Series:Materials
Subjects:
electrochemical migration
copper dendrites
PCB-Cu
PCB-ENIG
thin electrolyte layer
Online Access:http://www.mdpi.com/1996-1944/10/2/137

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http://www.mdpi.com/1996-1944/10/2/137

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