Numerical Analysis of the Welding Behaviors in Micro-Copper Bumps
In this study, three-dimensional simulations of the ultrasonic vibration bonding process of micro-copper blocks were conducted using the finite element method. We analyzed the effects of ultrasonic vibration frequency on the stress field, strain field, and temperature field at the copper bump joint...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2021-03-01
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| Series: | Metals |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2075-4701/11/3/460 |