Laser Grinding of Single-Crystal Silicon Wafer for Surface Finishing and Electrical Properties

Laser Grinding of Single-Crystal Silicon Wafer for Surface Finishing and Electrical Properties

In this paper, we first report the laser grinding method for a single-crystal silicon wafer machined by diamond sawing. 3D laser scanning confocal microscope (LSCM), X-ray diffraction (XRD), scanning electron microscope (SEM), X-ray photoelectron spectroscopy (XPS), laser micro-Raman spectroscopy we...

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Bibliographic Details
Main Authors: Xinxin Li, Yimeng Wang, Yingchun Guan
Format: Article
Language:English
Published: MDPI AG 2021-03-01
Series:Micromachines
Subjects:
laser grinding
nanosecond laser
single-crystal silicon wafer
surface finishing
resistivity
Online Access:https://www.mdpi.com/2072-666X/12/3/262

Internet

https://www.mdpi.com/2072-666X/12/3/262

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