Accelerated reliability testing of Cu-Al bimetallic contact by a micropattern corrosion testing platform for wire bond device application

Accelerated reliability testing of integrated circuit (IC) packages, such as wire-bonded devices, is a useful tool for predicting the lifetime corrosion behavior of real-world devices. Standard tests, such as highly accelerated stress test, involves subjecting an encapsulated device to high levels o...

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Bibliographic Details
Main Authors: Goutham Issac Ashok Kumar, John Alptekin, Joshua Caperton, Ashish Salunke, Oliver Chyan
Format: Article
Language:English
Published: Elsevier 2021-01-01
Series:MethodsX
Subjects:
Online Access:http://www.sciencedirect.com/science/article/pii/S2215016121001138