Accelerated reliability testing of Cu-Al bimetallic contact by a micropattern corrosion testing platform for wire bond device application
Accelerated reliability testing of integrated circuit (IC) packages, such as wire-bonded devices, is a useful tool for predicting the lifetime corrosion behavior of real-world devices. Standard tests, such as highly accelerated stress test, involves subjecting an encapsulated device to high levels o...
Main Authors: | , , , , |
---|---|
Format: | Article |
Language: | English |
Published: |
Elsevier
2021-01-01
|
Series: | MethodsX |
Subjects: | |
Online Access: | http://www.sciencedirect.com/science/article/pii/S2215016121001138 |