Preparation and Characterization of High Thermal Conductivity and Low CTE Polyimide Composite Reinforced with Diamond Nanoparticles/SiC Whiskers for 3D IC Interposer RDL Dielectric

Preparation and Characterization of High Thermal Conductivity and Low CTE Polyimide Composite Reinforced with Diamond Nanoparticles/SiC Whiskers for 3D IC Interposer RDL Dielectric

Low thermal conductivity and large coefficient of thermal expansion (CTE) are the most serious disadvantages of the polymer dielectric for the interposer redistribution layer (RDL). In this paper, a high thermal conductivity and low CTE composite with polyimide (PI) matrix and diamond nanoparticles/...

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Bibliographic Details
Main Authors: Jiangbo Luo, Yongpeng Wu, Yunna Sun, Guilian Wang, Yanmei Liu, Xiaolin Zhao, Guifu Ding
Format: Article
Language:English
Published: MDPI AG 2019-05-01
Series:Applied Sciences
Subjects:
diamond nanoparticle
SiC whisker
polyimide
high conductivity composite
interposer
redistribution layer dielectric
Online Access:https://www.mdpi.com/2076-3417/9/9/1962

Internet

https://www.mdpi.com/2076-3417/9/9/1962

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