The Influence of Wire Speed on Phase Transitions and Residual Stress in Single Crystal Silicon Wafers Sawn by Resin Bonded Diamond Wire Saw

The Influence of Wire Speed on Phase Transitions and Residual Stress in Single Crystal Silicon Wafers Sawn by Resin Bonded Diamond Wire Saw

Lower warp is required for the single crystal silicon wafers sawn by a fixed diamond wire saw with the thinness of a silicon wafer. The residual stress in the surface layer of the silicon wafer is the primary reason for warp, which is generated by the phase transitions, elastic-plastic deformation,...

Full description

Bibliographic Details
Main Authors: Tengyun Liu, Peiqi Ge, Wenbo Bi
Format: Article
Language:English
Published: MDPI AG 2021-04-01
Series:Micromachines
Subjects:
diamond wire saw
silicon wafer
phase transition
residual stress
wire speed
Online Access:https://www.mdpi.com/2072-666X/12/4/429

Internet

https://www.mdpi.com/2072-666X/12/4/429

Similar Items