Morphology Evaluation of Microelectronic Packaging Substrates Using Shadow Moiré Technique
The surface quality and long-term reliability of packaging substrates in microelectronic packaging processes have become subjects of increasing concern as circuit board component density increases while the pitches of these components decrease. As a result, packaging substrate morphology inspection...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
IEEE
2018-01-01
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| Series: | IEEE Access |
| Subjects: | |
| Online Access: | https://ieeexplore.ieee.org/document/8370237/ |