Fabrication and characteristics of flexible normally-off AlGaN/GaN HEMTs
In this paper, we present a method for removing a high electron mobility transistor (HEMT) silicon substrate using mechanical grinding and deep silicon etching technology and successfully transferred the epitaxial wafer to a PET substrate to achieve the flexible normally-off HEMT. By testing the out...
Main Authors: | , , , , , , , , , |
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Format: | Article |
Language: | English |
Published: |
AIP Publishing LLC
2020-10-01
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Series: | AIP Advances |
Online Access: | http://dx.doi.org/10.1063/5.0025587 |