Fully Solution-Processable Fabrication of Multi-Layered Circuits on a Flexible Substrate Using Laser Processing

Fully Solution-Processable Fabrication of Multi-Layered Circuits on a Flexible Substrate Using Laser Processing

The development of printing technologies has enabled the realization of electric circuit fabrication on a flexible substrate. However, the current technique remains restricted to single-layer patterning. In this paper, we demonstrate a fully solution-processable patterning approach for multi-layer c...

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Bibliographic Details
Main Authors: Seok Young Ji, Wonsuk Choi, Hoon-Young Kim, Jin-Woo Jeon, Sung-Hak Cho, Won Seok Chang
Format: Article
Language:English
Published: MDPI AG 2018-02-01
Series:Materials
Subjects:
interconnection
multi-layer patterning
laser sintering
femtosecond laser ablation
Online Access:http://www.mdpi.com/1996-1944/11/2/268

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http://www.mdpi.com/1996-1944/11/2/268

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