Monitoring Strain Response of Epoxy Resin during Curing and Cooling Using an Embedded Strain Gauge

The present work describes the monitoring system of the real-time strain response on the curing process of epoxy resin from the initial point of curing to the end, and the change in strain during temperature changes. A simple mould was designed to embed the strain gauge, thermometer, and quartz stan...

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Bibliographic Details
Main Authors: Hongyu Dong, Huiming Liu, Arata Nishimura, Zhixiong Wu, Hengcheng Zhang, Yemao Han, Tao Wang, Yongguang Wang, Chuanjun Huang, Laifeng Li
Format: Article
Language:English
Published: MDPI AG 2021-12-01
Series:Sensors
Subjects:
Online Access:https://www.mdpi.com/1424-8220/21/1/172