Stress-Free Bonding Technology with Pyrex for Highly Integrated 3D Fluidic Microsystems
In this article, a novel Pyrex reflow bonding technology is introduced which bonds two functional units made of silicon via a Pyrex reflow bonding process. The practical application demonstrated here is a precision dosing system that uses a mechanically actuated membrane micropump which includes pas...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2014-09-01
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| Series: | Micromachines |
| Subjects: | |
| Online Access: | http://www.mdpi.com/2072-666X/5/3/783 |