Stitching equipotential metallization areas on the double-sided printed circuit board
The linking (stitching) of equipotential metallization areas located on different layers of the printed circuit board is carried out using layer-to-layer vias. The purposes can be different, e. g.: heat removal from heat-loaded components, reduction of the thermal resistance of the board (reducing t...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
CRI «Electronics»
2020-06-01
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| Series: | Радиопромышленность |
| Subjects: | |
| Online Access: | https://www.radioprom.org/jour/article/view/704 |