Health Condition Assessment of Base-Plate Solder for Multi-Chip IGBT Module in Wind Power Converter
The base-plate solder fatigue of the IGBT module is one of the failures of the wind power converter; however, the existing health condition monitoring method based on infrared thermography is difficult to be applied to the actual applications. In this paper, a health condition assessment method of t...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
IEEE
2019-01-01
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| Series: | IEEE Access |
| Subjects: | |
| Online Access: | https://ieeexplore.ieee.org/document/8718597/ |