Dry etching of monocrystalline silicon using a laser-induced reactive micro plasma

Dry etching of monocrystalline silicon using a laser-induced reactive micro plasma

Dry etching is a prevalent technique for pattern transfer and material removal in microelectronics, optics and photonics due to its high precision material removal with low surface and subsurface damage. These processes, including reactive ion etching (RIE) and plasma etching (PE), are performed at...

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Bibliographic Details
Main Authors: Robert Heinke, Martin Ehrhardt, Pierre Lorenz, Klaus Zimmer
Format: Article
Language:English
Published: Elsevier 2021-12-01
Series:Applied Surface Science Advances
Subjects:
Plasma formation
Laser
Reactive etching
Si
CF4
Online Access:http://www.sciencedirect.com/science/article/pii/S266652392100115X

Internet

http://www.sciencedirect.com/science/article/pii/S266652392100115X

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