Interface Growth and Void Formation in Sn/Cu and Sn0.7Cu/Cu Systems

Interface Growth and Void Formation in Sn/Cu and Sn0.7Cu/Cu Systems

In this work, the effects of electroplated Cu (EP Cu) and Cu addition (0.7%) in Sn solder on the intermetallic compounds (IMCs) growth and void formation were clarified by comparison with solder joints comprising of high purity Cu (HP Cu) substrate and pure Sn solder. After aging processes, a new IM...

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Bibliographic Details
Main Authors: Jieshi Chen, Yongzhi Zhang, Zhishui Yu, Peilei Zhang, Wanqin Zhao, Jin Yang, Di Wu
Format: Article
Language:English
Published: MDPI AG 2018-12-01
Series:Applied Sciences
Subjects:
Sn/Cu solder joint
intermetallic compounds
void
electroplated Cu
Cu addition
Online Access:https://www.mdpi.com/2076-3417/8/12/2703

Internet

https://www.mdpi.com/2076-3417/8/12/2703

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