Rapid Formation of Kinetically Sprayed Cu-Sn Intermetallic Film
The kinetically spraying method was used to fabricate an in situ copper- (Cu-) tin (Sn) intermetallic compound (IMC) film with its thickness of approximately 1 μm using a Cu-Sn mixed powder. Microsized Cu (~5 μm) and Sn (~10 μm) powders were mixed at its ratio of 45 : 55 wt.%, respectively, and then...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Hindawi Limited
2019-01-01
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| Series: | Journal of Nanomaterials |
| Online Access: | http://dx.doi.org/10.1155/2019/4575079 |