The TDDB Characteristics of Ultra-Thin Gate Oxide MOS Capacitors under Constant Voltage Stress and Substrate Hot-Carrier Injection

The breakdown characteristics of ultra-thin gate oxide MOS capacitors fabricated in 65 nm CMOS technology under constant voltage stress and substrate hot-carrier injection are investigated. Compared to normal thick gate oxide, the degradation mechanism of time-dependent dielectric breakdown (TDDB) o...

Full description

Bibliographic Details
Main Authors: Jingyu Shen, Can Tan, Rui Jiang, Wei Li, Xue Fan, Jianjun Li, Jingping Wu
Format: Article
Language:English
Published: Hindawi Limited 2018-01-01
Series:Advances in Condensed Matter Physics
Online Access:http://dx.doi.org/10.1155/2018/5483756