The TDDB Characteristics of Ultra-Thin Gate Oxide MOS Capacitors under Constant Voltage Stress and Substrate Hot-Carrier Injection
The breakdown characteristics of ultra-thin gate oxide MOS capacitors fabricated in 65 nm CMOS technology under constant voltage stress and substrate hot-carrier injection are investigated. Compared to normal thick gate oxide, the degradation mechanism of time-dependent dielectric breakdown (TDDB) o...
Main Authors: | , , , , , , |
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Format: | Article |
Language: | English |
Published: |
Hindawi Limited
2018-01-01
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Series: | Advances in Condensed Matter Physics |
Online Access: | http://dx.doi.org/10.1155/2018/5483756 |