Study on precision dicing process of SiC wafer with diamond dicing blades
An innovative method for high-speed micro-dicing of SiC has been proposed using two types of diamond dicing blades, a resin-bonded dicing blade and a metal-bonded dicing blade. The experimental research investigated the radial wear of the dicing blade, the maximum spindle current, the surface morpho...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
AIP Publishing LLC
2021-09-01
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| Series: | Nanotechnology and Precision Engineering |
| Online Access: | http://dx.doi.org/10.1063/10.0005152 |