A Novel Sealing Redistribution Layer Approach for Through-Glass via Fabrication
A sealing redistribution layer (RDL) approach for the interposer fabrication is developed to simplify the conventional bottom-up process flow. By using this approach, bottom-up plating can achieve the integration of Cu-filler plating and its bottom RDL simultaneously. In this paper, through-glass vi...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
IEEE
2017-01-01
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| Series: | IEEE Journal of the Electron Devices Society |
| Subjects: | |
| Online Access: | https://ieeexplore.ieee.org/document/7809077/ |