Microfabrication of Ni-Fe Mold Insert via Hard X-ray Lithography and Electroforming Process

Microfabrication of Ni-Fe Mold Insert via Hard X-ray Lithography and Electroforming Process

In this research, a Ni-Fe mold insert for the efficient replication of high aspect-ratio microstructure arrays was fabricated via hard X-ray lithography and an electroforming process. For the X-ray exposure on a photoresist, a gold-based X-ray mask was prepared with conventional UV photolithography....

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Bibliographic Details
Main Authors: Jae Man Park, Sung Cheol Park, Da Seul Shin, Jong Hyun Kim, Hanlyun Cho, Woo Seok Yang, Seong Ho Son, Seong Jin Park
Format: Article
Language:English
Published: MDPI AG 2020-04-01
Series:Metals
Subjects:
UV photolithography
beam analysis
X-ray exposure
development
electroforming
Online Access:https://www.mdpi.com/2075-4701/10/4/486

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https://www.mdpi.com/2075-4701/10/4/486

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