NUMERICAL SIMULATION OF PH EFFECT ON COPPER ELECTRODEPOSITION INSIDE INSULATED TRENCH - PART I

NUMERICAL SIMULATION OF PH EFFECT ON COPPER ELECTRODEPOSITION INSIDE INSULATED TRENCH - PART I

Current distribution of copper electrodeposition in a trench (at different flow conditions) was studied taking into consideration the effect of hydrogen evolution. Due to pH effect on solubility of Cu+2 ions and the feasibility to precipitate as hydroxides at high pH, thus the importance of such stu...

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Main Author: WATHEQ NASER HUSSEIN
Format: Article
Language:English
Published: Taylor's University 2017-04-01
Series:Journal of Engineering Science and Technology
Subjects:
Current distribution
Modeling
Comsol
Electrodeposition
Copper
Trench.
Online Access:http://jestec.taylors.edu.my/Vol%2012%20issue%204%20April%202017/12_4_12.pdf
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spelling doaj-85f0fdc464f541e9be55e7ff9a8bc9862020-11-25T01:32:25ZengTaylor's UniversityJournal of Engineering Science and Technology1823-46902017-04-0112410221036NUMERICAL SIMULATION OF PH EFFECT ON COPPER ELECTRODEPOSITION INSIDE INSULATED TRENCH - PART I WATHEQ NASER HUSSEIN0Babylon University, College of Engineering, IraqCurrent distribution of copper electrodeposition in a trench (at different flow conditions) was studied taking into consideration the effect of hydrogen evolution. Due to pH effect on solubility of Cu+2 ions and the feasibility to precipitate as hydroxides at high pH, thus the importance of such study was handled. The results showed that the deposition in general was non uniform along the lateral walls, the non-uniformity not affected by current or flow velocity. Velocity not affect H+ concentration inside the trench and its value remained the same as that for the initial one meaning that Cu hydroxide precipitate was not possible. http://jestec.taylors.edu.my/Vol%2012%20issue%204%20April%202017/12_4_12.pdfCurrent distributionModelingComsolElectrodepositionCopperTrench.
collection DOAJ
language English
format Article
sources DOAJ
author WATHEQ NASER HUSSEIN
spellingShingle WATHEQ NASER HUSSEIN
NUMERICAL SIMULATION OF PH EFFECT ON COPPER ELECTRODEPOSITION INSIDE INSULATED TRENCH - PART I
Journal of Engineering Science and Technology
Current distribution
Modeling
Comsol
Electrodeposition
Copper
Trench.
author_facet WATHEQ NASER HUSSEIN
author_sort WATHEQ NASER HUSSEIN
title NUMERICAL SIMULATION OF PH EFFECT ON COPPER ELECTRODEPOSITION INSIDE INSULATED TRENCH - PART I
title_short NUMERICAL SIMULATION OF PH EFFECT ON COPPER ELECTRODEPOSITION INSIDE INSULATED TRENCH - PART I
title_full NUMERICAL SIMULATION OF PH EFFECT ON COPPER ELECTRODEPOSITION INSIDE INSULATED TRENCH - PART I
title_fullStr NUMERICAL SIMULATION OF PH EFFECT ON COPPER ELECTRODEPOSITION INSIDE INSULATED TRENCH - PART I
title_full_unstemmed NUMERICAL SIMULATION OF PH EFFECT ON COPPER ELECTRODEPOSITION INSIDE INSULATED TRENCH - PART I
title_sort numerical simulation of ph effect on copper electrodeposition inside insulated trench - part i
publisher Taylor's University
series Journal of Engineering Science and Technology
issn 1823-4690
publishDate 2017-04-01
description Current distribution of copper electrodeposition in a trench (at different flow conditions) was studied taking into consideration the effect of hydrogen evolution. Due to pH effect on solubility of Cu+2 ions and the feasibility to precipitate as hydroxides at high pH, thus the importance of such study was handled. The results showed that the deposition in general was non uniform along the lateral walls, the non-uniformity not affected by current or flow velocity. Velocity not affect H+ concentration inside the trench and its value remained the same as that for the initial one meaning that Cu hydroxide precipitate was not possible.
topic Current distribution
Modeling
Comsol
Electrodeposition
Copper
Trench.
url http://jestec.taylors.edu.my/Vol%2012%20issue%204%20April%202017/12_4_12.pdf
work_keys_str_mv AT watheqnaserhussein numericalsimulationofpheffectoncopperelectrodepositioninsideinsulatedtrenchparti
_version_ 1725082192576512000

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