Compact and Low-Profile On-Chip Antenna Using Underside Electromagnetic Coupling Mechanism for Terahertz Front-End Transceivers

Compact and Low-Profile On-Chip Antenna Using Underside Electromagnetic Coupling Mechanism for Terahertz Front-End Transceivers

The results presented in this paper show that by employing a combination of metasurface and substrate integrated waveguide (SIW) technologies, we can realize a compact and low-profile antenna that overcomes the drawbacks of narrow-bandwidth and low-radiation properties encountered by terahertz anten...

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Bibliographic Details
Main Authors: Mohammad Alibakhshikenari, Bal S. Virdee, Ayman A. Althuwayb, Dion Mariyanayagam, Ernesto Limiti
Format: Article
Language:English
Published: MDPI AG 2021-05-01
Series:Electronics
Subjects:
antenna on-chip (AoC)
metasurface
substrate integrated waveguide (SIW)
terahertz (THz)
electromagnetic (EM) coupling
feeding mechanism
Online Access:https://www.mdpi.com/2079-9292/10/11/1264

Internet

https://www.mdpi.com/2079-9292/10/11/1264

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