The Wafer-Level Integration of Single-Crystal LiNbO<sub>3</sub> on Silicon via Polyimide Material

The Wafer-Level Integration of Single-Crystal LiNbO<sub>3</sub> on Silicon via Polyimide Material

In situ measurements of sensing signals in space platforms requires that the micro-electro-mechanical system (MEMS) sensors be located directly at the point to be measured and in contact with the subject to be measured. Traditional radiation-tolerant silicon-based MEMS sensors cannot acquire spatial...

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Bibliographic Details
Main Authors: Xiangyu Yang, Wenping Geng, Kaixi Bi, Linyu Mei, Yaqing Li, Jian He, Jiliang Mu, Xiaojuan Hou, Xiujian Chou
Format: Article
Language:English
Published: MDPI AG 2021-01-01
Series:Micromachines
Subjects:
LiNbO3 single crystalline
low-temperature bonding
oxygen plasma activation
polyimide material
radiation-hardened properties
low-temperature tolerance
Online Access:https://www.mdpi.com/2072-666X/12/1/70

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https://www.mdpi.com/2072-666X/12/1/70

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