Microfluidic System Protocols for Integrated On-Chip Communications and Cooling
The advancements in multi-core central processing units have attracted new designs ranging from mechanisms of packing higher number of transistors into the small space, new techniques for communications (e.g., wireless network on chips), or new methodologies for cooling the chip. The latter two desi...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
IEEE
2017-01-01
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| Series: | IEEE Access |
| Subjects: | |
| Online Access: | https://ieeexplore.ieee.org/document/7859303/ |