Effect of Recrystallization on β to α-Sn Allotropic Transition in 99.3Sn–0.7Cu wt. % Solder Alloy Inoculated with InSb

Effect of Recrystallization on β to α-Sn Allotropic Transition in 99.3Sn–0.7Cu wt. % Solder Alloy Inoculated with InSb

The effect of recrystallization of 99.3Sn−0.7Cu wt. % solder alloy on the allotropic transition of β to α-Sn (so-called tin pest phenomenon) was investigated. Bulk samples were prepared, and an InSb inoculator was mechanically applied to their surfaces to enhance the tran...

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Bibliographic Details
Main Authors: Agata Skwarek, Balázs Illés, Tamás Hurtony, David Bušek, Karel Dušek
Format: Article
Language:English
Published: MDPI AG 2020-02-01
Series:Materials
Subjects:
tin pest
recrystallization
grain size
β to α-sn allotrope transition
snagcu (sac)
electrical resistance measurement
Online Access:https://www.mdpi.com/1996-1944/13/4/968

Internet

https://www.mdpi.com/1996-1944/13/4/968

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