Multilayer circuits with thick-film polymer insulation
Three design and technological versions of multilayer circuit have been developed. The interlayer and protective isolation in these circuits was performed with thick (10—30 micron) heat-resistant photosensitive organic dielectric film. Such performance allows to attach component leads to the contact...
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| Format: | Article |
| Language: | English |
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Politehperiodika
2012-10-01
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| Series: | Tekhnologiya i Konstruirovanie v Elektronnoi Apparature |
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| Online Access: | http://www.tkea.com.ua/tkea/2012/5_2012/pdf/01.zip |