Research on the Shape Precison of the Micro-groove in the Silicon under Diamond Fly-cutting
Based on the mechanical physical characteristics of the silicon wafers and the superior processing character of the diamond fly-cutting, the diamond fly-cutting was applied to the machining of the microgroove in the silicon, and the effect of the processing parameters on the machining shape precisio...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
EDP Sciences
2016-01-01
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| Series: | MATEC Web of Conferences |
| Online Access: | http://dx.doi.org/10.1051/matecconf/20166703023 |