Vertical integration of microchips by magnetic assembly and edge wire bonding
Hands-off production of 3D sensing microsystems A strategy for the magnetically assisted vertical assembly of microchips into their substrates and for their electrical connection could offer a versatile solution for the construction of fragile and complex miniaturized sensors. Conventional contact-b...
| Main Authors: | , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Nature Publishing Group
2020-02-01
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| Series: | Microsystems & Nanoengineering |
| Online Access: | https://doi.org/10.1038/s41378-019-0126-6 |