Atomic insights of Cu nanoparticles melting and sintering behavior in CuCu direct bonding
With a layer of Cu nanoparticle slurry, it's promising to achieve fast CuCu direct bonding at low temperature. To have a deeper insight and better control of the process, we apply molecular dynamics method to simulate the melting and sintering behavior of Cu nanoparticles during the direct bon...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2021-01-01
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| Series: | Materials & Design |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S0264127520307759 |