Insights into the curing kinetics of epoxy/PLA: Implications of the networking structure

Insights into the curing kinetics of epoxy/PLA: Implications of the networking structure

The curing kinetics of thermoset-thermoplastic compounds based on diglycidyl ether of bisphenol A (DGEBA), methyl tetrahydrophthalic anhydride (MTHPA) as the hardener, 2,4,6-tris(dimethylaminomethyl)phenol (DEH 35) as a catalyzer, and poly(lactic acid) (PLA) as workable (i.e., with repairable bonds)...

Full description

Bibliographic Details
Main Authors: I. D. S. Silva, J. J. P. Barros, A. Albuquerque, N. G. Jaques, M. V. L. Fook, R. M. R. Wellen
Format: Article
Language:English
Published: Budapest University of Technology 2020-12-01
Series:eXPRESS Polymer Letters
Subjects:
polymer blends and alloys
epoxy
pla
curing kinetics
workable microstructure
Online Access:http://www.expresspolymlett.com/letolt.php?file=EPL-0010750&mi=cd

Internet

http://www.expresspolymlett.com/letolt.php?file=EPL-0010750&mi=cd

Similar Items