Insights into the curing kinetics of epoxy/PLA: Implications of the networking structure
The curing kinetics of thermoset-thermoplastic compounds based on diglycidyl ether of bisphenol A (DGEBA), methyl tetrahydrophthalic anhydride (MTHPA) as the hardener, 2,4,6-tris(dimethylaminomethyl)phenol (DEH 35) as a catalyzer, and poly(lactic acid) (PLA) as workable (i.e., with repairable bonds)...
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Budapest University of Technology
2020-12-01
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doaj-9811683c305e4f1d88d221c755e8e4932020-11-25T02:49:32ZengBudapest University of Technology eXPRESS Polymer Letters1788-618X2020-12-0114121180119610.3144/expresspolymlett.2020.96Insights into the curing kinetics of epoxy/PLA: Implications of the networking structureI. D. S. SilvaJ. J. P. BarrosA. AlbuquerqueN. G. JaquesM. V. L. FookR. M. R. WellenThe curing kinetics of thermoset-thermoplastic compounds based on diglycidyl ether of bisphenol A (DGEBA), methyl tetrahydrophthalic anhydride (MTHPA) as the hardener, 2,4,6-tris(dimethylaminomethyl)phenol (DEH 35) as a catalyzer, and poly(lactic acid) (PLA) as workable (i.e., with repairable bonds) phase was investigated using Fourier transform infrared spectroscopy (FTIR) and differential scanning calorimetry (DSC). Hydrogen bonding between PLA carbonyl and epoxy hydroxyl and oxirane groups is the main influent interaction taking place, which acts as changing providers (i.e. hydrogen bonded groups able to move) of curing rate and degree of curing as evaluated from the vibration bands and exothermal released heat. With increasing PLA content, the real crosslink density decreases as also the curing rate is delayed. Partially miscibility between epoxy and PLA is proposed, whereas after reaching epoxy’s solubility limit PLA precipitates, hence the microstructure is suggested to be composed by the epoxy network, interacted Epoxy/PLA and precipitated PLA. Reported data offer reliable tools to reach the aimed degree of crosslinking, controlling of epoxy microstructure overcoming the brittle fracture providing a wider window of processing and applications.http://www.expresspolymlett.com/letolt.php?file=EPL-0010750&mi=cdpolymer blends and alloysepoxyplacuring kineticsworkable microstructure |
collection |
DOAJ |
language |
English |
format |
Article |
sources |
DOAJ |
author |
I. D. S. Silva J. J. P. Barros A. Albuquerque N. G. Jaques M. V. L. Fook R. M. R. Wellen |
spellingShingle |
I. D. S. Silva J. J. P. Barros A. Albuquerque N. G. Jaques M. V. L. Fook R. M. R. Wellen Insights into the curing kinetics of epoxy/PLA: Implications of the networking structure eXPRESS Polymer Letters polymer blends and alloys epoxy pla curing kinetics workable microstructure |
author_facet |
I. D. S. Silva J. J. P. Barros A. Albuquerque N. G. Jaques M. V. L. Fook R. M. R. Wellen |
author_sort |
I. D. S. Silva |
title |
Insights into the curing kinetics of epoxy/PLA: Implications of the networking structure |
title_short |
Insights into the curing kinetics of epoxy/PLA: Implications of the networking structure |
title_full |
Insights into the curing kinetics of epoxy/PLA: Implications of the networking structure |
title_fullStr |
Insights into the curing kinetics of epoxy/PLA: Implications of the networking structure |
title_full_unstemmed |
Insights into the curing kinetics of epoxy/PLA: Implications of the networking structure |
title_sort |
insights into the curing kinetics of epoxy/pla: implications of the networking structure |
publisher |
Budapest University of Technology |
series |
eXPRESS Polymer Letters |
issn |
1788-618X |
publishDate |
2020-12-01 |
description |
The curing kinetics of thermoset-thermoplastic compounds based on diglycidyl ether of bisphenol A (DGEBA), methyl tetrahydrophthalic anhydride (MTHPA) as the hardener, 2,4,6-tris(dimethylaminomethyl)phenol (DEH 35) as a catalyzer, and poly(lactic acid) (PLA) as workable (i.e., with repairable bonds) phase was investigated using Fourier transform infrared spectroscopy (FTIR) and differential scanning calorimetry (DSC). Hydrogen bonding between PLA carbonyl and epoxy hydroxyl and oxirane groups is the main influent interaction taking place, which acts as changing providers (i.e. hydrogen bonded groups able to move) of curing rate and degree of curing as evaluated from the vibration bands and exothermal released heat. With increasing PLA content, the real crosslink density decreases as also the curing rate is delayed. Partially miscibility between epoxy and PLA is proposed, whereas after reaching epoxy’s solubility limit PLA precipitates, hence the microstructure is suggested to be composed by the epoxy network, interacted Epoxy/PLA and precipitated PLA. Reported data offer reliable tools to reach the aimed degree of crosslinking, controlling of epoxy microstructure overcoming the brittle fracture providing a wider window of processing and applications. |
topic |
polymer blends and alloys epoxy pla curing kinetics workable microstructure |
url |
http://www.expresspolymlett.com/letolt.php?file=EPL-0010750&mi=cd |
work_keys_str_mv |
AT idssilva insightsintothecuringkineticsofepoxyplaimplicationsofthenetworkingstructure AT jjpbarros insightsintothecuringkineticsofepoxyplaimplicationsofthenetworkingstructure AT aalbuquerque insightsintothecuringkineticsofepoxyplaimplicationsofthenetworkingstructure AT ngjaques insightsintothecuringkineticsofepoxyplaimplicationsofthenetworkingstructure AT mvlfook insightsintothecuringkineticsofepoxyplaimplicationsofthenetworkingstructure AT rmrwellen insightsintothecuringkineticsofepoxyplaimplicationsofthenetworkingstructure |
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