Improvement of the adhesion strength between copper plated layer and resin substrate using a chemically adsorbed monolayer
With reducing the size and weight of electric devices, high-tensile, light and fine copper wire is demanded. So the production technique of a copper wire plated on a super fiber resin (Vectran film) was researched for improving the adhesion strength between the copper and the resin. In this study, w...
Main Authors: | , , |
---|---|
Format: | Article |
Language: | English |
Published: |
EDP Sciences
2013-08-01
|
Series: | MATEC Web of Conferences |
Online Access: | http://dx.doi.org/10.1051/matecconf/20130405004 |