Improvement of the adhesion strength between copper plated layer and resin substrate using a chemically adsorbed monolayer

With reducing the size and weight of electric devices, high-tensile, light and fine copper wire is demanded. So the production technique of a copper wire plated on a super fiber resin (Vectran film) was researched for improving the adhesion strength between the copper and the resin. In this study, w...

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Bibliographic Details
Main Authors: Tsuchiya K., Ohtake T., Ogawa K.
Format: Article
Language:English
Published: EDP Sciences 2013-08-01
Series:MATEC Web of Conferences
Online Access:http://dx.doi.org/10.1051/matecconf/20130405004