Parallel Multiphysics Simulation of Package Systems Using an Efficient Domain Decomposition Method
With the continuing downscaling in feature sizes, the thermal impact on material properties and geometrical deformations can no longer be ignored in the analysis of the electromagnetic compatibility or electromagnetic interference of package systems, including System-in-Package and antenna arrays. W...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2021-01-01
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| Series: | Electronics |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2079-9292/10/2/158 |