Nano-mechanical Behaviour and Mmicrostructural Evolution of Cu/Si Thin Films at Different Annealing Temperatures

Nano-mechanical Behaviour and Mmicrostructural Evolution of Cu/Si Thin Films at Different Annealing Temperatures

This study investigates the nano-mechanical properties of as-deposited Cu/Si thin films indented to a depth of 2000 nm using a nanoindentation technique. Cu films with a thickness of 1800 nm are deposited on (100) silicon substrates and the indented specimens are then annealed at temperatures of 1...

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Bibliographic Details
Main Authors: Woei-Shyan Lee, Tao-Hsing Chen, Chi-Feng Lin, Yu-Liang Chuang
Format: Article
Language:English
Published: Taiwan Association of Engineering and Technology Innovation 2012-07-01
Series:International Journal of Engineering and Technology Innovation
Subjects:
Nanoindentation
Silicon
Microstructural evolution
Annealing temperature
Online Access:http://sparc.nfu.edu.tw/~ijeti/download/V2-no3-207-215.pdf

Internet

http://sparc.nfu.edu.tw/~ijeti/download/V2-no3-207-215.pdf

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