Leaching of Copper from Waste-Printed Circuit Boards (PCBs) in Sulfate Medium Using Cupric Ion and Oxygen
In the present paper, the leaching of copper from printed circuit boards (PCBs) using sulfuric acid with Cu<sup>2+</sup> and O<sub>2</sub> is proposed. The effects of various process parameters such as agitation speed, temperature, the type and the flow rate of gas, initial C...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2021-08-01
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| Series: | Metals |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2075-4701/11/9/1369 |